The lamp bead packaging pad structure of the full-color COB display screen consists of a lamp cup, four pads (the first, second, third, and fourth pads) and three chips.
Inside the lamp cup, the pads are carefully laid out. The first pad is in the center of an equilateral L shape, and the remaining pads are distributed in an orderly manner to ensure the stability of the package. The chip configuration is optimized to achieve a display effect with uniform color mixing and a large light-emitting angle.
Introduction
With the rapid development of display technology, full-color COB (Chip On Board) display screens are widely used in indoor and outdoor displays, billboards, stage backgrounds and other fields due to their high brightness, high contrast, high color saturation and other advantages. Has been widely used.
As the core component of the full-color COB display screen, the design of the lamp bead packaging pad structure has an important impact on the performance and reliability of the display screen.
This article will conduct a technical discussion on the lamp bead packaging pad structure of the full-color COB display screen, and introduce its structural characteristics, design principles and optimization directions in detail.
Overview
The lamp bead packaging pad structure of the full-color COB display screen mainly includes key components such as a lamp cup, multiple pads, and chips. As the basis of the packaging structure, the lamp cup provides stable support for the pads and chips. The soldering pad is used to connect the chip to the external circuit to achieve photoelectric conversion and light-emitting functions. The chip is the core component for photoelectric conversion, and its performance directly affects the display effect of the display screen.
Features
High stability
The full-color COB display lamp bead packaging pad structure adopts precise welding technology and high-quality packaging materials to ensure a strong and reliable connection between the pad and the chip. At the same time, the reasonable pad layout can effectively prevent damage and failure caused by external impact or temperature changes, and improve the stability and reliability of the display.
Mix colors evenly
The pad layout and chip arrangement are carefully designed to enable the full-color COB display to achieve a uniform color mixing effect.
By precisely controlling the luminous intensity and luminous angle of different color chips, high color reproduction and realistic display effects are achieved.
Large lighting angle
The design of the lamp bead packaging pad structure of the full-color COB display screen fully considers the factors affecting the light-emitting angle. By optimizing the pad layout and chip arrangement, the display can present bright and uniform light effects at different angles. . This helps expand the viewing range and application scenarios of the display.
Design principles
The design principles of the lamp bead packaging pad structure of the full-color COB display screen mainly include the following aspects:
Pad layout design
Pad layout is one of the key factors in ensuring display screen performance. During the design process, factors such as the number, shape, size and arrangement of the pads need to be fully considered to ensure a strong and reliable connection between the pads and the chip, while achieving a uniform color mixing effect and a large lighting angle.
Packaging material selection
The choice of packaging material has an important impact on the performance and reliability of the display screen. High-quality packaging materials should have good insulation, high temperature resistance, corrosion resistance and other characteristics to ensure a stable and reliable connection between the pad and the chip, while improving the durability and life of the display.
Wafer selection and arrangement
The chip is the core component for photoelectric conversion, and its performance directly affects the display effect of the display screen. When selecting a chip, factors such as its luminous efficiency, luminous color, and luminous angle need to be fully considered. At the same time, the arrangement of the chips also needs to be carefully designed to achieve a uniform color mixing effect and a large lighting angle.
Full-color COB display screen lamp bead packaging pad structure optimization direction
In order to further improve the performance and reliability of the full-color COB display screen, the following optimizations can be made in the lamp bead packaging pad structure in the future:
Improve pad layout design
By optimizing factors such as the number, shape, size, and arrangement of pads, the stability and reliability of the connection between the pads and the chip can be further improved.
Develop new packaging materials
Develop new packaging materials with higher performance to increase the durability and lifespan of displays.
Optimize die selection and arrangement
By improving the selection and arrangement of the wafers, a more uniform color mixing effect and a larger lighting angle are achieved.
Summarize
The lamp bead packaging pad structure of the full-color COB display screen is one of the key factors in the performance and reliability of the display screen.
By optimizing the pad layout design, selecting high-quality packaging materials, and optimizing chip selection and arrangement, the performance and reliability of the full-color COB display can be further improved.
In the future, with the continuous advancement and innovation of technology, full-color COB displays will be widely used in more fields.