The full flip-chip ultra-fine pitch COB LED display adopts advanced COB packaging technology to achieve a point pitch below P1.0 and supports ultra-fine pitch below P0.5.
It has high brightness, high contrast, high reliability and other characteristics, meeting the needs of Demand in the high-end display field improves image clarity and display quality, providing important support for the development of future display technology.
Introduction
With the continuous advancement of technology and the growing demand of consumers for high-quality display experience, the full flip-chip ultra-fine pitch COB LED display screen, as an emerging display technology, has high definition, high contrast, high reliability, etc. Advantages, gradually occupy an important position in the high-end display market. This article will introduce in detail the manufacturing process of full flip-chip ultra-fine pitch COB LED display, including material preparation, process flow, quality control, etc.
Material preparation
- LED chip: The LED chip is the core component of the full flip-chip ultra-fine pitch COB LED display, and its quality directly affects the display effect and performance of the display. Therefore, during the manufacturing process, it is necessary to select high-quality LED chips to ensure that they have stable luminous performance, good heat dissipation performance and long service life.
- PCB board: PCB board is the substrate of the full flip-chip ultra-fine pitch COB LED display, used to carry LED chips and circuits. In terms of material selection, PCB boards with excellent electrical, mechanical and thermal properties need to be selected to ensure the stability and reliability of the display.
- Epoxy resin: Epoxy resin is an important material for encapsulating LED chips and has excellent insulation properties, temperature resistance and chemical corrosion resistance. During the manufacturing process, high-quality epoxy resin needs to be used to ensure that the LED chip is tightly encapsulated in the colloid to prevent damage to the chip from the external environment.
Process flow
- LED chip preparation: Cut and arrange the selected LED chips according to the specified spacing and arrangement to facilitate subsequent patching operations.
- PCB board processing: Clean, dry and pre-process the PCB board to ensure that its surface is clean and flat to facilitate the placement of LED chips.
- SMT: Place the sorted LED chips on the PCB board in the specified order and position to form an LED dot matrix. During the placement process, high-precision placement equipment and technology are required to ensure the placement accuracy and consistency of LED chips.
- Welding: Use multi-pass welding technology to connect the output circuits of the LED chips together in series, and then connect the drive circuits. During the welding process, welding temperature and time need to be strictly controlled to ensure welding quality and reliability.
- Encapsulation: Use epoxy resin to encapsulate the PCB board with the LED chip attached. During the packaging process, high-pressure injection technology is required to inject epoxy resin into the gap between the PCB board and the LED chip to ensure that the LED chip is tightly encapsulated in the colloid. At the same time, the encapsulated display screen needs to be left at a constant temperature for a period of time to allow the epoxy resin to fully solidify.
- Cutting and splicing: Cut the packaged display screen according to the specified size, and combine multiple small screens into a large screen through splicing technology. During the cutting and splicing process, high-precision equipment and technology are required to ensure the dimensional accuracy and splicing quality of the display.
- Testing and debugging: Test and debug the manufactured display screen, including testing of brightness, color, contrast, uniformity, etc. During the testing and debugging process, professional testing equipment and software are required to ensure that the performance and quality of the display meet standards.
QC
During the manufacturing process, quality control is a key link to ensure the performance and quality of full flip-chip ultra-fine pitch COB LED displays. It is necessary to establish a complete quality control system, including raw material inspection, process inspection and finished product inspection. In the manufacturing process, it is also necessary to use advanced testing equipment and technology to monitor and detect key processes in real time to ensure the stability and reliability of the manufacturing process.
Advantages of full flip-chip design
The full flip-chip design is one of the important features of the full flip-chip ultra-fine pitch COB LED display.
By mounting the LED chip face down on the PCB board, more contact surfaces between the chip circuit surface and the PCB board can be made, thereby improving the heat dissipation effect.
At the same time, the full flip-chip design can also reduce the vulnerability of electronic components with high melting points caused by high temperatures and improve the reliability and stability of the display. In addition, the full flip-chip design can also achieve higher dot matrix density and clearer display effects.
Summarize
As an emerging display technology, the full flip-chip ultra-fine pitch COB LED display has broad application prospects in the high-end display market.
Through a detailed introduction to its manufacturing process and quality control, it can be seen that the full flip-chip ultra-fine pitch COB LED display has excellent performance and quality assurance.
In the future, with the continuous advancement of technology and the continuous expansion of the market, full flip-chip ultra-fine pitch COB LED displays will be applied and developed in more fields.
Full flip-chip ultra-fine pitch COB screen factory
Shenzhen Chifuyi Technology Co., Ltd. (CHIFE) full flip-chip ultra-fine pitch COB LED screen factory focuses on producing high-quality, ultra-fine pitch LED displays, using advanced COB packaging technology to create ultra-high definition and high reliability Display products meet various high-end display needs and are the leading LED display manufacturing experts in the industry.
CHIFE focuses on the development and production of high-quality, high-performance indoor displays. It adopts advanced flip-chip COB technology to ensure clear and delicate pictures and vivid and realistic colors.
CHIFE company has been engaged in the research and development of LED display screens for more than 15 years. High-end COB LED display screen factory, the world’s leading COB LED display company, provides users with customized COB LED display screens; we also provide creative LED display screens, outdoor LED displays, indoor LED displays, and rental LED display products.