The MIP packaging technology of LED display is an important technology in the field of Micro LED display. Its full name is Mini/Micro LED in Package.
MIP packaging technology overview
MIP packaging technology is a technology for chip-level packaging of Mini/Micro LED chips. It transfers a large amount of Micro LED chips to the carrier board on the epitaxial wafer, and then directly packages them, cuts them into single or multi-in-one small chips, and then splits and mixes the small chips, and then carries out the patching process, screen body Surface coating and other steps finally complete the production of the display screen.
This packaging technology can perfectly inherit the “surface mount” process, and as the price of Mini/Micro LED chips decreases, it will effectively promote the iteration of the micro-pitch market to low-cost technology.
Core features of MIP packaging technology
- Highly integrated: MIP packaging technology realizes the seamless integration of LED chips and discrete devices, improves the integration of the display, and makes the display thinner, lighter and more efficient.
- Reduced manufacturing costs: Compared with traditional packaging technology, MIP packaging technology can significantly reduce the manufacturing cost of micro-pitch LED displays. This is mainly due to its efficient packaging process and improvement in yield, which greatly reduces production costs.
- Improve display effect: MIP packaging technology can comprehensively measure Micro RGB pixels, and the spectroscopic card ratio is more accurate and detailed. This enables LED lamp beads encapsulated with MIP technology to perform extremely well in terms of brightness, contrast and color consistency at different viewing angles, thereby improving the display effect of the display.
- Reduce maintenance requirements: When a broken lamp bead is detected, the MIP-encapsulated LED screen can be removed and replaced separately without affecting other parts of the screen. This makes subsequent maintenance more convenient and reduces maintenance costs.
- Excellent protective performance: MIP packaging technology provides excellent dust-proof, moisture-proof and anti-static properties for LED devices, which can better resist external invasion and improve the reliability and stability of the display screen.
- Good heat dissipation performance: MIP packaged LED modules have better heat dissipation performance, so they have lower power consumption and temperature rise, extending the service life of the display.
Process flow of MIP packaging technology
The process flow of MIP packaging technology mainly includes the following steps:
- Mass transfer: Mass transfer of Micro LED chips on the epitaxial wafer to the carrier board.
- Direct packaging: Directly package the Micro LED chip transferred to the carrier board.
- Cutting: Cut the encapsulated Micro LED chip into single or multiple small chips.
- Light splitting and mixing: Perform light splitting and mixing on the small chip to ensure the uniformity of its color and brightness.
- SMT process: The processed small chips are subjected to the SMT process to form a complete display structure.
- Screen surface coating: Cover the display surface with a protective film to improve its scratch resistance, anti-fouling and other properties.
Market Application of MIP Packaging Technology
MIP packaging technology is mainly used in the Mini LED field, and its products are mainly used in commercial displays, virtual shooting, consumer fields, etc. These areas have huge potential in the future, which is also one of the considerations for MIP to become a mainstream packaging technology. At present, leading manufacturers such as Nationstar Optoelectronics, Jingtai Optoelectronics, and Zhongqi Optoelectronics have deployed and applied MIP technology and achieved good results, accelerating the industrialization process of Micro LED.
Comparison between MIP packaging technology and COB technology
The full name of COB technology is Chip-on-Board, which is a technology that directly binds LED chips to the circuit board. Compared with MIP technology, COB technology has absolute advantages in reliability and stability.
However, MIP technology has obvious advantages in terms of manufacturing cost and yield. MIP technology reduces the accuracy requirements of the carrier board, improves the production yield of the carrier board, and its manufacturing process is less difficult and cost-effective. In addition, MIP technology also has better adaptability. A MiP device can meet product applications with different point spacings.
Summarize
As an important technology in the field of Micro LED display, MIP packaging technology has the advantages of high integration, low manufacturing cost, excellent display effect and low maintenance requirements.
With the continuous evolution of technology and the growing market demand, MIP packaging technology will be more widely used and developed in the future. At the same time, we also look forward to more innovative technologies and solutions that can promote the further development of the Micro LED display industry.